AEC_Q100_Rev_G_Base_Document(20)

车用电子产品的执行标准。

AEC - Q100 - REV-G

May 14, 2007

Automotive Electronics Council

Component Technical Committee

Legend for Table 2

Notes: H

P B N D S G K

Required for hermetic packaged devices only. Required for plastic packaged devices only.

Required Solder Ball Surface Mount Packaged (BGA) devices only.

Nondestructive test, devices can be used to populate other tests or they can be used for production. Destructive test, devices are not to be reused for qualification or production. Required for surface mount plastic packaged devices only.

Generic data allowed. See section 2.3, Table 1, and Appendix 1.

# Reference Number for the particular test.

* All electrical testing before and after the qualification stresses are performed to the limits of the

individual device specification in temperature and limit value.

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