AEC_Q100_Rev_G_Base_Document(19)

时间:2025-05-03

车用电子产品的执行标准。

TEST GROUP F – DEFECT SCREENING TESTS

ABV ADDITIONAL REQUIREMENTS # NOTES SAMPLE SIZE / LOT NUMBER OF LOTS ACCEPT CRITERIA TEST METHOD

STRESS

PAT

AEC Q001 It is highly desirable that the supplier adopt these tests in their standard manufacturing operation.

Process Average Testing F1 --- --- --- ---

F2

AEC Q002

Statistical Bin/Yield Analysis --- --- --- ---

SBA

TEST GROUP G – CAVITY PACKAGE INTEGRITY TESTS

ABV # NOTES SAMPLE SIZE / LOT NUMBER OF LOTS ACCEPT CRITERIA TEST METHOD ADDITIONAL REQUIREMENTS

STRESS

Component Technical Committee

Mechanical Shock

MS

H, D, G 0 Fails G1 39 3

JEDEC JESD22-B104

Y1 plane only, 5 pulses, 0.5 msec duration, 1500 g peak acceleration. TEST .Automotive Electronics Council

Table 2: Qualification Test Methods (continued)

Page 16 of 32

VFV

H, D, G 0 Fails

Variable Frequency Vibration G2 39 3

JEDEC JESD22-B103

20 Hz to 2 KHz to 20 Hz (logarithmic variation) in >4 minutes, 4X in each orientation, 50 g peak acceleration. TEST before and after at room .

Constant Acceleration

H, D, G 0 Fails CA G3 39 3

MIL-STD-883 Method 2001

Y1 plane only, 30 K g-force for <40 pin packages, 20 K g-force for 40 pins and greater. TEST before and after at room temperature.

MIL-STD-883 Method 1014 Any single-specified fine test followed by any single-specified gross test. For ceramic packaged cavity devices only.

Gross/Fine Leak

GFL

H, D, G G4 39 3

0 Fails

Package Drop DROP G5 H, D, G 5 1

0 Fails

---

Drop part on each of 6 axes once from a height of 1.2m onto a concrete surface. This test is for MEMS cavity devices only. TEST before and after DROP at room temperature.

Lid Torque

H, D, G LT G6

G7

G8

H, D, G

5

5

3

1

1

1

0 Fails

MIL-STD-883 Method 2024 For ceramic packaged cavity devices only.

AEC - Q100 - REV-G

May 14, 2007

Die Shear

DS

IWV

0 Fails

MIL-STD-883 Method 2019 To be performed before cap/seal for all cavity devices.

Internal Water Vapor

H, D, G 0 Fails

MIL-STD-883 Method 1018 For ceramic packaged cavity devices only.

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