AEC_Q100_Rev_G_Base_Document(13)

车用电子产品的执行标准。

TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTS

# NOTES SAMPLE SIZE / LOT NUMBER OF LOTS ACCEPT CRITERIA TEST METHOD ADDITIONAL REQUIREMENTS

STRESS

ABV

Component Technical Committee

Preconditioning

0 Fails PC A1

P, B, S, N, G

JEDEC J-STD-020 JESD22-A113

Automotive Electronics Council

Performed on surface mount devices only. PC performed before THB/HAST, AC/UHST, TC, and PTC stresses. It is recommended that J-STD-020 be performed to determine what preconditioning level to perform in the actual PC stress per JA113. The minimum acceptable level for qualification is level 3 per JA113. Where applicable, Temperature must be reported when Delamination from the die surface in JA113/J-STD-020 is acceptable if the device passes the subsequent Qualification tests. Any replacement of devices must be reported. TEST before and after PC at room temperature.

Table 2: Qualification Test Methods

Page 10 of 32

A2

0 Fails P, B, D, G

Temperature-Humidity-Bias or Biased HAST THB or HAST

JEDEC JESD22-A101 or A110

For surface mount devices, PC before THB 85oC/85%RH 1000 hours or HAST (130oC/85%RH for 96 hours, or 110C/85%RH for . TEST before and after THB or HAST at room and hot temperature.

Autoclave or Unbiased HAST

A3

P, B, D, G

AEC - Q100 - REV-G

May 14, 2007

AC or UHST

0 Fails

JEDEC JESD22-A102, A101

For surface mount devices, PC before AC 121oC/15psig 96 hours or unbiased HAST (130°C/85%RH for 96 hours, or 110oC/85%RH for . TEST before and after AC or UHST at room temperature.