AEC_Q100_Rev_G_Base_Document(16)

车用电子产品的执行标准。

TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTS

# NOTES ADDITIONAL REQUIREMENTS SAMPLE SIZE / LOT NUMBER OF LOTS ACCEPT CRITERIA TEST METHOD

STRESS ABV

Wire Bond Shear WBS C1

H, P, D, G CPK >1.33 PPk >1.67 AEC Q100-001 At appropriate time interval for each bonder to be used.

30 bonds from a minimum of 5 devices

Wire Bond Pull WBP C2

H, P, D, G

CPK >1.33 PPk >1.67 or 0 Fails after TC (test #A4) MIL-STD883 Method 2011

Condition C or D. inimum pull strength after TC = 3 grams. bond pull shall be performed with the hook

Component Technical Committee

Solderability SD C3

H, P, D, G

15 1

>95% lead coverage

JEDEC JESD22-B102

If burn-in screening is normally performed on the device before shipment, samples for SD must first undergo burn-in. Perform 8 hour steam aging prior to testing (1 hour for Au-plated leads).

Automotive Electronics Council

Table 2: Qualification Test Methods (continued)

Page 13 of 32

C4

H, P, B, D, G

Physical Dimensions 10 3

CPK >1.33 PPK >1.67

PD

JEDEC JESD22-B100 and B108

See applicable JEDEC standard outline and individual device spec for significant dimensions and tolerances.

Solder Ball Shear

B SBS C5

5 balls from a min. of 10 devices

3

CPK >1.33 PPK >1.67 AEC Q100-010 PC thermally (two 220ºC reflow cycles) before integrity (mechanical) testing.

Lead Integrity LI C6

H, P, D, G

10 leads from each of 5 parts

1

No lead breakage or cracks JEDEC JESD22-B105

Not required for surface mount devices. Only required for through-hole devices.

TEST GROUP D – DIE FABRICATION RELIABILITY TESTS

# NOTES SAMPLE SIZE / LOT NUMBER OF LOTS ACCEPT CRITERIA TEST METHOD ADDITIONAL REQUIREMENTS

STRESS

ABV

Electromigration EM D1 --- --- ---

---

---

The data, test method, calculations and internal criteria should be available to the user upon request for new technologies.

AEC - Q100 - REV-G

May 14, 2007

Time Dependent Dielectric Breakdown D2

TDDB --- --- --- --- ---

The data, test method, calculations and internal criteria should be available to the user upon request for new technologies.