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256MB, 512MB Registered DIMMs

Operating Temperature Condition

SymbolTOPER

ParameterOperating Temperature

Rating0 to 95

Units

DDR2 SDRAM

Notes

°3

1.Operating Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to

JESD51.2 standard.

2.At 0 - 85 °C, operation temperature range are the temperature which all DRAM specification will be supported.

3.At 85 - 95 °C operation temperature range, doubling refresh commands in frequency to a 32ms period ( tREFI=3.9 us ) is required, and to enter to self refresh mode at this temperature range, an EMRS command is required to change internal refresh rate.

Input DC Logic Level

SymbolVIH(DC)VIL(DC)

ParameterDC input logic high DC input logic low

Min.VREF + 0.125

- 0.3

Max.VDDQ + 0.3VREF - 0.125

UnitsVV

Notes

Input AC Logic Level

SymbolVIH(AC)VIL(AC)

ParameterAC input logic high AC input logic low

DDR2-400, DDR2-533Min.VREF + 0.250

-Max.-VREF - 0.250

Min.VREF + 0.200

VREF - 0.200

DDR2-667

Max.

UnitsVV

Notes

AC Input Test Conditions

SymbolVREFVSWING(MAX)

SLEW

Input reference voltage

Input signal maximum peak to peak swingInput signal minimum slew rate

Condition

Value0.5 * VDDQ

1.01.0

UnitsVVV/ns

Notes112, 3

Notes:

1. Input waveform timing is referenced to the input signal crossing through the VIH/IL(AC) level applied to the device under test.

2. The input signal minimum slew rate is to be maintained over the range from VREF to VIH(AC) min for rising edges and the range from VREF to VIL(AC)max for falling edges as shown in the below figure.

3. AC timings are referenced with input waveforms switching from VIL(AC) to VIH(AC) on the positive transitions and VIH(AC) to VIL(AC) on the negativetransitions.

VDDQVIH(AC) min

VSWING(MAX)

VIH(DC) minVREF

VIL(DC) maxVIL(AC) max

delta TF

VREF - VIL(AC) max

Falling Slew =

delta TF

delta TR

VSS

VIH(AC) min - VREF

Rising Slew =

delta TR

< AC Input Test Signal Waveform >