LED行业高频词汇

SIP :single in-line package

SIR :surface insulation resistance 绝缘阻抗

SMC :Surface Mount Component 表面黏着组件

SMD :Surface Mount Device 表面黏着组件

SMEMA :Surface Mount Equipment

Manufacturers Association 表面黏着设备制造协会

SMT :surface mount technology 表面黏着技术

SOIC :small outline integrated circuit

SOJ :small out-line j-leaded package

SOP :small out-line package 小外型封装

SOT :small outline transistor 晶体管

SPC :statistical process control 统计过程控制

SSOP :shrink small outline package 收缩型小外形封装

TAB :tape automaticed bonding 带状自动结合

TCE :thermal coefficient of expansion 膨胀(因热)系数

Tg :glass transition temperature 玻璃转换温度

THD :Through hole device 须穿过洞之组件(贯穿孔)

TQFP :tape quad flat package 带状四方平坦封装

UV :ultraviolet 紫外线

uBGA :micro BGA 微小球型矩阵

cBGA :ceramic BGA 陶瓷球型矩阵

PTH lated Thru Hole 导通孔

IA Information Appliance 信息家电产品

MESH 网目

OXIDE 氧化物

FLUX 助焊剂

LGA (Land Grid Arry)封装技术 LGA封装不需植球，适合轻薄短小产品 应用。

TCP (Tape Carrier Package)

ACF Anisotropic Conductive Film 异方性导电胶膜制程

Solder mask 防焊漆

Soldering Iron 烙铁

Solder balls 锡球

Solder Splash 锡渣

Solder Skips 漏焊

Through hole 贯穿孔

Touch up 补焊

Briding 穚接(短路)

Solder Wires 焊锡线

Solder Bars 锡棒

Green Strength 未固化强度(红胶)

Transter Pressure 转印压力(印刷)