LED行业高频词汇

pilot hole 引导孔

terminal clearomee hole 端接全隙孔

dimensioned hole 准尺寸孔

via-in-pad 在连接盘中导通孔

hole location 孔位

hole density 孔密度

hole pattern 孔图

drill drawing 钻孔图

assembly drawing 装配图

datum referan 参考基准

微组装技术﹕MPT/Microelectronic Packaging echnology

混装技术﹕Mixed Component Mounting Technology

封装﹕ Package

贴片﹕ Pick and Place

拆焊﹕ Desoldering

再流﹕Reflow

浸焊﹕ Dip Soldering

拖焊﹕ Drag soldering

印制电路﹕Printed Circuit

印制线路﹕ Printed Wiring

印制电路板﹕ printed circuit board

印制线路板﹕printed wiring board

层压板﹕laminate

覆铜薄层压板﹕copper-clad laminate

基材﹕base material

成品板﹕production board

印刷﹕printing

导电图形﹕conductive pattern

印制组件﹕printed component

单面印制板﹕single-sided printed board

双面印制板﹕double-sided printed board

多层印制板﹕multilayer printed board

电烙铁﹕ Iron

热风嘴﹕ hot air reflowing noozle

吸锡带﹕soldering wick

吸锡器﹕tin extractor

焊后检验﹕post-soldering inspection

目视检验﹕visual inspection

机器检验﹕ machine inspection

焊点质量﹕ soldering joint quality

焊电缺陷﹕ soldering jont defect

错焊﹕ solder wrong

漏焊﹕ solder skips

虚焊﹕ pseudo soldering