LED行业高频词汇

冷焊﹕ cold soldering

桥焊﹕ solder bridge

脱焊﹕ open soldering

焊点剥离﹕ solder off

不润湿焊点﹕ soldering nonwetting

锡珠﹕ solder ball

拉尖﹕ icicle ； solder projection

孔洞﹕ void

焊料爬越﹕ solder wicking

过热焊点﹕ overheated solder connection

不饱和焊点﹕ insufficient solder connection

过量焊点﹕ excess solder connection

助焊剂剩余﹕ flux residue

焊料裂纹﹕ solder crazeing

焊角翘起﹕ fillet-lifting ；lift-off

AI :Auto-Insertion 自动插件

AQL :acceptable quality level 允收水平

ATE :automatic test equipment 自动测试

ATM :atmosphere 气压

BGA :ball grid array 球形矩阵

CCD :charge coupled device 监视连接组件(摄影机)

CLCC :Ceramic leadless chip carrier 陶瓷引脚载具

COB :chip-on-board 芯片直接贴附在电路板上

cps :centipoises(黏度单位) 百分之一

CSB :chip scale ball grid array 芯片尺寸BGA

CSP :chip scale package 芯片尺寸构装

CTE :coefficient of thermal expansion 热膨胀系数

DIP :dual in-line package 双内线包装(泛指手插组件)

FPT :fine pitch technology 微间距技术

FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作PCB材质)

IC :integrate circuit 集成电路

IR :infra-red 红外线

Kpa :kilopascals(压力单位)

LCC :leadless chip carrier 引脚式芯片承载器

MCM :multi-chip module 多层芯片模块

MELF :metal electrode face 二极管

MQFP :metalized QFP 金属四方扁平封装

NEPCON :National Electronic Package and

Production Conference 国际电子包装及生产会议

ppm:parts per million 指每百万PAD(点)有多少个不良PAD(点)

psi :pounds/inch2 磅/英吋2

PWB :printed wiring board 电路板

QFP :quad flat package 四边平坦封装