LED行业高频词汇

logic design automation 逻辑设计自动化

separated time 分线

separated layer 分层

definite sequence 定顺序

conduction (track) 导线（通道）

conductor width 导线（体）宽度

conductor spacing 导线距离

conductor layer 导线层

conductor line/space 导线宽度/间距

conductor layer No.1 第一导线层

round pad 圆形盘

square pad 方形盘

diamond pad 菱形盘

oblong pad 长方形焊盘

bullet pad 子弹形盘

teardrop pad 泪滴盘

snowman pad 雪人盘

V-shaped pad V形盘

annular pad 环形盘

non-circular pad 非圆形盘

isolation pad 隔离盘

monfunctional pad 非功能连接盘

offset land 偏置连接盘

back-bard land 腹（背）裸盘

anchoring spaur 盘址

land pattern 连接盘图形

land grid array 连接盘网格阵列

annular ring 孔环

component hole 元件孔

mounting hole 安装孔

supported hole 支撑孔

unsupported hole 非支撑孔

via 导通孔

plated through hole (PTH) 镀通孔

access hole 余隙孔

blind via (hole) 盲孔

buried via hole 埋孔

buried blind via 埋,盲孔

any layer inner via hole 任意层内部导通孔

all drilled hole 全部钻孔

toaling hole 定位孔

landless hole 无连接盘孔

interstitial hole 中间孔

landless via hole 无连接盘导通孔