(2007)基于ColdFire的评估系统的设计与实现(4)

基于ColdFire的评估系统的设计与实现

3.2.2 不同BDM接口的比较..................................................................................29

3.3 BDM调试头的硬件设计.......................................................................................30

3.3.1 BDM的串行通信时序分析.............................................................................30

3.3.2 XC9536XL芯片介绍......................................................................................31

3.3.3 BDM调试头硬件实现....................................................................................32

3.4 BDM调试头驱动程序的设计...............................................................................34

3.4.1 BDM的数据通信格式....................................................................................34

3.4.2 BDM的串行通信实现....................................................................................35

3.4.3 BDM的调试命令............................................................................................37

3.5 本章小结...............................................................................................................39

第四章 软件设计........................................................................................404.1 SdIDE通用模块介绍.............................................................................................404.1.1 SdIDE简介......................................................................................................404.1.2 SdIDE通用模块..............................................................................................414.2 交叉编译器...........................................................................................................424.2.1 关于交叉编译器.............................................................................................424.2.2 构建嵌入式开发的GCC工具链....................................................................434.2.3 Makefile...........................................................................................................464.3 连接器...................................................................................................................484.3.1 目标文件格式.................................................................................................484.3.2 连接脚本.........................................................................................................494.4 代码的写入及运行...............................................................................................524.4.1 烧写Flash.......................................................................................................524.4.2 程序在SDRAM中运行.................................................................................544.4.3 监控程序.........................................................................................................554.5 本章小结...............................................................................................................56第五章 评估板应用编程示例....................................................................575.1 嵌入式应用程序设计的基本知识........................................................................575.1.1 硬件系统初始化.............................................................................................575.1.2 应用程序初始化.............................................................................................585.2 通用IO口的编程实例.........................................................................................595.2.1 编程基础.........................................................................................................605.2.2 编程步骤.........................................................................................................615.2.3 程序测试与固化.............................................................................................625.3 μClinux的板级移植..............................................................................................625.3.1 bootloader开发与移植....................................................................................635.3.2 μClinux的移植................................................................................................645.4 本章小结...............................................................................................................66第六章 总结与展望....................................................................................686.1 总结.......................................................................................................................68