BIT3367 datasheet-A1(6)
发布时间:2021-06-10
发布时间:2021-06-10
恒流源DC-DC芯片 BIT3367
Soldering information
Reflow soldering:
The choice of heating method may be influenced by plastic QFP package). If infrared or vapor phase heating is used
the oven.
≧ 3
mm
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
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