针对高速SPI FLASH的PCB走线规则。

Spansion® Serial Peripheral Interface (SPI) FL Flash Layout Guide

Application Note

1.Introduction

The Spansion serial peripheral interface (SPI) flash devices are high speed synchronous access non-volatile memory devices. Standard high speed layout practices should be followed when performing printed circuit board (PCB) design with SPI flash. This application note outlines PCB layout recommendations for Spansion SPI flash devices, including S25FL-P, S70FL-P, S25FL-S, and S70FL-S flash families.

2.Basic SPI Flash Connectivity

All S25FL devices feature one flash die per package and are enabled via a single chip select control input. All S70FL devices feature two identical die per package which are individually enabled via two chip select control inputs and all other control inputs and I/O are shared between die. Figures2.1 and Figure2.2 illustrate basic Host to SPI Flash configuration options for S25FL flash and S70FL flash, respectively.

Figure 2.1 Simplified Connection Diagrams for S25FL Single and Multi I/O Configurations

PublicationNumberSPI_Layout_Guide_ANRevision02IssueDateApril8,2011