模拟开关选型手册

模拟开关芯片/方案选型指南

2008

模拟开关芯片/方案选型指南

2

( ) TI (BGA QFN WCSP)

TI

FET DSP CPU (TI)

TI

SpecifiedVoltage Range(V+)

TI 0.8V 40V 300 MHz (insertion loss) TI TI (TS) TS (charge injection)

ON-State Resistance Range(ron)

SpecifiedVoltage Range(V+ and –(V-))

2008

模拟开关芯片/方案选型指南

TI

TI PCIe (application speci c) TS2PCIE412 Gen-I ǖ PCIe ǘ PCIe (RX) (TX) (differential pairs) PCB (skew) 2.5 Gbps TS3L500AE (SPDT) (Gigabit) 1000 Base-T (1000 Mbps) LED

/ VGA HDMI/DVI LVDS (Source) (Drain) ǘ

(crosstalk) ǘ ǘ / (ch-to-ch /bit-to-bit) ǘ (ESD) ESD

I/O I/O ǘ

(wear out) (CMOS) (FET)

ǜ

ǜ

V+ V+ (clipping)

vs.

( ) CBT CBTLV

(positive) (negative) V+ I+ V+

VIH/VIL ǜ (VIH VIL)

( ) TI TS

TI ǖ (V+) ǜ

(Solid state) ǜ

2008

模拟开关芯片/方案选型指南

TI

( )

0 < VI/O < (V+ – 2 V) n VI/O V+ VGS n /p 0 < VI/O < V+ V+

(Crosstalk) ǖ

( ) (decoupled) CMOS (pop)

VCOMVCharge Injection (pC

)

(ron) (degradation) / (CI/O) / I+

(ron(flat))

706050403020100-10-20-30

01

234Bias Voltage (V)

56

BBM

2.52.0

MBB

ron(flat)( )

1.51.00.50

(OFF Isolation)

/ (CON/COFF) (settling) CMOS / …… 此处隐藏：1437字，全部文档内容请下载后查看。喜欢就下载吧 ……