CDR01BP109ABSR中文资料(9)
时间:2025-04-06
时间:2025-04-06
元器件交易网
CERAMIC CHIP CAPACITORS
Packaging Information
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
96©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
元器件交易网
CERAMIC CHIP CAPACITORS
Packaging Information
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
97
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