IRLML9303TRPBF;中文规格书,Datasheet资料
时间：2025-04-17
Application(s)
System/Load Switch
Features and Benefits
results in
ORDERING INFORMATION:
See detailed ordering and shipping information on the last page of this data sheet.
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Notes through are on page 10
1
03/09/12
IRLML9303TRPbF
Electric Characteristics @ T = 25°C (unless otherwise specified)
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0.1
1
10
100
-VDS, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
100)
(A tnerru10
C ercuo-Sot-nia1
rD ,DI-0.1
IRLML9303TRPbF
0.1
1
10
100
-VDS, Drain-to-Source Voltage (V)
Fig 2. Typical Output Characteristics
)no(DSTJ , Junction Temperature (°C)
Fig 4. Normalized On-Resistance
vs. Temperature
3
R, Drain-to-Source On Resistance
IRLML9303TRPbF
1000
14.0
-VGS, Gate-to-
Source Voltage (V)
12.010.08.06.04.02.00.0
C, Capacitance (pF)
100
10
1
10
-VDS, Drain-to-Source Voltage (V)
100
012345
QG, Total Gate Charge (nC)
Fig 5. Typical Capacitance vs.Drain-to-Source VoltageFig 6. Typical Gate Charge vs.
Gate-to-Source Voltage
100
100
10
0.1
0.01
0.1
1
10
100
10
-ID, Drain-to-Source Current (A
)
-ISD, Reverse Drain Current (A)
1
1
0.1
0.01
-VDS, Drain-to-Source Voltage (V)
Fig 7. Typical Source-Drain Diode
Forward Voltage
Fig 8. Maximum Safe Operating Area
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IRLML9303TRPbF
2.5
RD
2.0-ID, Drain Current (A
)
VDD
1.5
1.0
0.5
Fig 10a. Switching Time Test Circuit
tttt0.0
25
50
75
100
125
150
TA , Ambient Temperature (°C)
VFig 9. Maximum Drain Current vs.
Ambient Temperature
VDS
Fig 10b. Switching Time Waveforms
Fig 11. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
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400
RDS(on), Drain-to -Source On Resistance (m )
RDS(on), Drain-to
-Source On Resistance (m )
500600500
400300200
10000
5
10
15
20
-I
D, Drain Current (A)
300
200
100
02
4
6
8
10
12
14
16
18
20
-VGS, Gate -to -Source Voltage (V)
Fig 12. Typical On-Resistance vs.
Gate Voltage
Fig 13. Typical On-Resistance vs.
Drain Current
Id
QgodrQgdQgs2Qgs1
Fig 14a.
Gate Charge WaveformFig 14b. Gate Charge Test Circuit
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1000
)
(V ega)
tloW
( Vrdelowhoserh Petls euta PG ,elg)nhitS(SG-VTJ , Temperature ( °C )
Fig 15. Typical Threshold Voltage vs.
Junction Temperature
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600
400
200
1E-71E-61E-51E-41E-31E-21E-11E+0
Time (sec)
Fig 16. Typical Power vs. Time
7
IRLML9303TRPbF
Micro3 (SOT-23) Package Outline
Dimensions are shown in millimeters (inches)
DIMENSIONS
SYMBOL
MILLIMETERSMIN
MAX
INCHESMIN
MAX
Recommended Footprint
c
AA1A2bLL1L2
0.890.010.880.300.400.540.2501.120.101.020.500.60REFBSC8 "$ % ! 0 ## !#REFBSC8
1. DIMENSIONING & TOLERANCING PER ANSI Y14.5M-19942. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. DIMENSION: MILLIMETER.
E H IS LOCATED AT THE MOLD PARTING LINE.ED AT DATUM PLANE H.
IMENSIONS D AND E1 ARE MEASURED AT DATUM PLANE H. DIMENSIONS DOES NOT INCLUDE MOLD PROTRUSIONS OR INTERLEAD FLASH. MOLD PROTRUSIONS R INTERLEAD FLASH SHALL NOT EXCEED 0.25 MM [0.010 INCH] PER SIDE. LENGTH FOR SOLDERING TO A SUBSTRATE.8. OUTLINE CONFORMS TO JEDEC OUTLINE TO-236 AB.
Micro3 (SOT-23/TO-236AB) Part Marking Information
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IRLML9303TRPbF
Micro3 Tape & Reel Information
Dimensions are shown in millimeters (inches)
2.05 ( .080 )1.95 ( .077 )
1.6 ( .062 )1.5 ( .060 )
1.32 ( .051 )4.1 ( .161 )1.85 ( .072 )1.12 ( …… 此处隐藏：2951字，全部文档内容请下载后查看。喜欢就下载吧 ……
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