朗广电器厂PCB设计规范

SW PCB Design Specification

王 勇 V1.0.0

1.1.1 1.1.1 PCB 外形尺寸PCB 外形尺寸及拼板设计外形尺寸及拼板设计 及拼板设计

PCB Dimension and jointed board design

当PCB 的尺寸小于160mm×120mm 时，必须进行拼板设计，拼板后的尺寸要小于240×200mm，最小拼板尺寸不能小于50mmX50mm，拼板设计时，原则上只加过板方向的工艺边。 When the PCB is smaller than the size of 160mm × 120mm, the need for jointed board design, jointed board size is less than the 240 × 200mm, the smallest size jointed board can not be less than 50mmX50mm, jointed board design, in principle, only increased its board direction Process Side

拼板的尺寸应以制造、装配、和测试过程中以便加工，不因拼板产生较大变形为宜。 jointed board size should be based on the manufacture, assembly, and testing process so that processing is not suitable for large deformation generated jointed board.

拼板中各块PCB 之间的互连采用邮票孔设计或者V-CUT设计，拼板邮票孔0.5mm范围以内不要布线，以防止应力作用拉断走线。

Jointed board pieces each interconnection between PCB designs using stamps or a V-CUT design, jointed board within the scope of stamps will not bore 0.5mm wiring, in order to prevent stress break in the alignment.

拼板的基准MARK 加在每块小板的对角上，一般为二个。

Benchmark of jointed board MARK added each small plate right corner, usually two.

PCB厚度设置为≥0.7mm。

PCB thickness is set to ≥ 0.7mm.

不规则PCB而没有制作拼板应加工艺边，不规则的PCB制成拼板后加工有困难时，应在两侧加工艺边。

PCB did not produce an irregular jigsaw edge technology should be added to, Irregular post-processing of PCB is made difficult jointed board should be added on both sides edge technology.

1.1.2 1.1.2 PCB 工艺边要求PCB 工艺边要求 工艺边要求

PCB edge technology demands

距PCB边缘5mm范围内不应有焊盘、通孔、MARK及小于3mm宽的走线。

Within 5mm from the PCB edge there should be no pad, through-hole, MARK and less

than 3mm wide alignment.

对终端有拼版的PCB边距要求：一般终端都有拼版所以贴片时的定位边不在设计的PCB

上，而在拼版边上，所以距板边距离只要满足加工误差及分板的误差即可，一般走线距PCB板边1mm以上即可，走线密时0.5mm也可以接受；终端走线一般为0.1mm，所以板边线只要满足安全距离(1mm以上)即对线宽没有要求。

Have make-up of the PCB-to-end margin requirements: Usually the terminal has

a make-up so when the patch is not designed for the positioning of PCB on the edge, while in the make-up edge, so as long as the distance from the plate edge to meet the processing error and the error can be sub-panels, The general alignment of more than 1mm away from the PCB board edge can take the line density can also be acceptable when the 0.5mm; terminal alignment is generally 0.1mm, so as long as the plate edges to meet a safe distance (1mm more) that is not required on the line widths.

如果在距PCB边缘5mm范围内有零件，则需增加工艺边，以保证PCB有足够的可夹持边

缘。工艺夹持边与PCB可用邮票孔或者V-CUT连接。

If the edge of 5mm from the PCB within the scope parts, you need to increase

technology side, in order to ensure adequate availability of PCB clamping edges. PCB edge clamping process can be used with stamp holes, or V-CUT connection. 工艺边内不能排布机装元器件，机装元器件的实体不能进入上下工艺边及其上空，如需

进入左右工艺边或上空，需与工艺员协商处理。

Process Side could not exclusive cloth machine mounted components, machine

components of the entity can not be loaded into the craft up and down over the edge and will need access to or above the left edge technology required to be handled through consultations with the craft.

手插元器件的实体不能落在上、下工艺边上方3mm高度内的空间中，如需落在左右工艺

边或上空，需与工艺员协商处理。

Hands component entities can not fall on the upper and lower side edge of

technology within the space of 3mm high, and if falls on or above the left edge technology required to deal with in consultation with the craft.

不规则的PCB没有做拼板设计时必须加工艺边。

The PCB does not do irregular jointed board design process must be added edge. 工艺边的宽度一般设置为5mm。

The width of the edge process in general is set to 5mm.

1.1.3 1.1.3 PCB 基准PCB 基准Mark点要求 点要求

PCB Benchmark Mark-point demand

拼板设置三个Mark点，呈L 形分布，且对角Mark 点关于中心不对称（以免SMT设备

错误地将A面零件贴在B面）,根据SW的实际情况，建议所有拼版在5mm工艺边上统一增加三个MARK点，具体参考如下图示：

Jointed board set 3 Mark points, was L-shaped distribution, and the right corner

point on the Center's Mark asymmetric (SMT equipment so as to avoid mistakenly

A side part attached to the B side), according to the actual situation in SW, it is recommended that all make-up process in the 5mm 3 MARK-point increase in

the edge of a unified, specific reference to the following icon:

单板设置2个Mark点，成对角线分布，且关于中心不对称，并且每个单板的Mark点相对

位置必须一样；如果有特殊要求需要定位单个元件的基准点标记,以提高贴装精度(比如在QFP、 …… 此处隐藏：13292字，全部文档内容请下载后查看。喜欢就下载吧 ……