朗广电器厂PCB设计规范

SW PCB Design Specification

王 勇 V1.0.0

1.1.1 1.1.1 PCB 外形尺寸PCB 外形尺寸及拼板设计外形尺寸及拼板设计 及拼板设计

PCB Dimension and jointed board design

当PCB 的尺寸小于160mm×120mm 时，必须进行拼板设计，拼板后的尺寸要小于240×200mm，最小拼板尺寸不能小于50mmX50mm，拼板设计时，原则上只加过板方向的工艺边。 When the PCB is smaller than the size of 160mm × 120mm, the need for jointed board design, jointed board size is less than the 240 × 200mm, the smallest size jointed board can not be less than 50mmX50mm, jointed board design, in principle, only increased its board direction Process Side

拼板的尺寸应以制造、装配、和测试过程中以便加工，不因拼板产生较大变形为宜。 jointed board size should be based on the manufacture, assembly, and testing process so that processing is not suitable for large deformation generated jointed board.

拼板中各块PCB 之间的互连采用邮票孔设计或者V-CUT设计，拼板邮票孔0.5mm范围以内不要布线，以防止应力作用拉断走线。

Jointed board pieces each interconnection between PCB designs using stamps or a V-CUT design, jointed board within the scope of stamps will not bore 0.5mm wiring, in order to prevent stress break in the alignment.

拼板的基准MARK 加在每块小板的对角上，一般为二个。

Benchmark of jointed board MARK added each small plate right corner, usually two.

PCB厚度设置为≥0.7mm。

PCB thickness is set to ≥ 0.7mm.

不规则PCB而没有制作拼板应加工艺边，不规则的PCB制成拼板后加工有困难时，应在两侧加工艺边。

PCB did not produce an irregular jigsaw edge technology should be added to, Irregular post-processing of PCB is made difficult jointed board should be added on both sides edge technology.

1.1.2 1.1.2 PCB 工艺边要求PCB 工艺边要求 工艺边要求

PCB edge technology demands

距PCB边缘5mm范围内不应有焊盘、通孔、MARK及小于3mm宽的走线。

Within 5mm from the PCB edge there should be no pad, through-hole, MARK and less

than 3mm wide alignment.

对终端有拼版的PCB边距要求：一般终端都有拼版所以贴片时的定位边不在设计的PCB

上，而在拼版边上，所以距板边距离只要满足加工误差及分板的误差即可，一般走线距PCB板边1mm以上即可，走线密时0.5mm也可以接受；终端走线一般为0.1mm，所以板边线只要满足安全距离(1mm以上)即对线宽没有要求。

Have make-up of the PCB-to-end margin requirements: Usually the terminal has

a make-up so when the patch is not designed for the positioning of PCB on the edge, while in the make-up edge, so as long as the distance from the plate edge to meet the processing error and the error can be sub-panels, The general alignment of more than 1mm away from the PCB board edge can take the line density can also be acceptable when the 0.5mm; terminal alignment is generally 0.1mm, so as long as the plate edges to meet a safe distance (1mm more) that is not required on the line widths.

如果在距PCB边缘5mm范围内有零件，则需增加工艺边，以保证PCB有足够的可夹持边

缘。工艺夹持边与PCB可用邮票孔或者V-CUT连接。

If the edge of 5mm from the PCB within the scope parts, you need to increase

technology side, in order to ensure adequate availability of PCB clamping edges. PCB edge clamping process can be used with stamp holes, or V-CUT connection. 工艺边内不能排布机装元器件，机装元器件的实体不能进入上下工艺边及其上空，如需

进入左右工艺边或上空，需与工艺员协商处理。

Process Side could not exclusive cloth machine mounted components, machine

components of the entity can not be loaded into the craft up and down over the edge and will need access to or above the left edge technology required to be handled through consultations with the craft.

手插元器件的实体不能落在上、下工艺边上方3mm高度内的空间中，如需落在左右工艺

边或上空，需与工艺员协商处理。

Hands component entities can not fall on the upper and lower side edge of

technology within the space of 3mm high, and if falls on or above the left edge technology required to deal with in consultation with the craft.

不规则的PCB没有做拼板设计时必须加工艺边。

The PCB does not do irregular jointed board design process must be added edge. 工艺边的宽度一般设置为5mm。

The width of the edge process in general is set to 5mm.

1.1.3 1.1.3 PCB 基准PCB 基准Mark点要求 点要求

PCB Benchmark Mark-point demand

拼板设置三个Mark点，呈L 形分布，且对角Mark 点关于中心不对称（以免SMT设备

错误地将A面零件贴在B面）,根据SW的实际情况，建议所有拼版在5mm工艺边上统一增加三个MARK点，具体参考如下图示：

Jointed board set 3 Mark points, was L-shaped distribution, and the right corner

point on the Center's Mark asymmetric (SMT equipment so as to avoid mistakenly

A side part attached to the B side), according to the actual situation in SW, it is recommended that all make-up process in the 5mm 3 MARK-point increase in

the edge of a unified, specific reference to the following icon:

单板设置2个Mark点，成对角线分布，且关于中心不对称，并且每个单板的Mark点相对

位置必须一样；如果有特殊要求需要定位单个元件的基准点标记,以提高贴装精度(比如在QFP、CSP、BGA等重要元件局部设定Mark)。

Mark veneer set two points, into a diagonal distribution, and on the Center's

asymmetry, and each veneer of Mark relative positions of points must be the same; If you have special requirements need to locate a single reference point for marking components to improve placement accuracy (such as QFP, CSP, BGA and other important components of local settings Mark)

同一板号PCB上所有Mark点的大小必须一致（包括不同厂家生产的同一板号的PCB）。 PCB on the same plate number of all points of the size of the Mark must be

consistent (including the different manufacturers of the same plate number of

the PCB).

统一制定所有图档Mark点大小和形状：设置Fiducial Mark 为直径为0.8mm的实心圆；

设置Solder mask为直径为3mm的圆形。如下图所示Φ0.8 mm 为Fiducial mark; Φ3mm内为 No mask区域；如果是双面都有SMT元件的PCB,则双面都需要加上MARK点。 Mark all the points to develop a unified image file size and shape: Set Fiducial

Mark as 0.8mm diameter solid circle; set Solder mask for the 3mm diameter circle. As shown below Φ0.8 mm for the Fiducial mark; Φ3mm within No mask region; if it is double-sided SMT components have a PCB, then both sides need to add MARK point.

Mark点标记可以是裸铜、清澈的防氧化涂层保护的裸铜、镀镍或镀锡、或焊锡涂层。 Mark-point markers can be bare copper, clear coating to protect the oxidation

of bare copper, nickel or tin, or solder coating.

Mark点标记的表面平整度应该在15 微米[0.0006"]之内。

Mark-point mark on the surface roughness should be 15 micron [0.0006 "] within. 当Mark点标记与印制板的基质材料之间出现高对比度时可达到最佳的性能。

As Mark points marked with the PCB substrate material when a high contrast ratio

between the optimal performance.

Mark点Φ3mm 内不允许有焊盘、过孔、测试点、丝印标识及Solder Mask等。Φ3mm之

外为Solder Mask。Mark 点不能被V-Cut所切造成机器无法辨识。不良设计如下图： Mark points allowed within Φ3mm pads, vias, test points, such as screen printing

logo and Solder Mask. Φ3mm outside of the Solder Mask. Mark points can not be V-Cut caused by the cutting machine is not recognized. Bad design of the following plans:

Mark点要求表面洁净、平整，边缘光滑、齐整，颜色与周围的背景色有明显区别。 Mark-point demand the surface clean, smooth, edge smooth, neat, color and background color of the surrounding significant difference.

1.1.4 1.1.4 定位孔要求 定位孔要求

Positioning hole requirements

PCB布板最好要有定位孔，以方便夹具定位；定位孔内部要求圆弧，直径2.0～3.0mm。 PCB hole layout would be best positioned to facilitate the positioning fixture;

positioning holes internal requirements arc, diameter 2.0 ~ 3.0mm.

定位孔内部圆弧必须大于1/4圆，并且要求有四个（四角各一个）；如果有定位孔内部

圆弧大于1/2圆，该圆弧所在的边可以只设一个定位孔。

Positioning holes within the arc must be greater than 1 / 4 circle, and require

four (one each corner); if there is positioned within the circular hole is greater than 1 / 2 circle, where the edge of the arc can only set up a positioning hole

距离定位孔边缘3.0mm不能布器件，3.0mm外靠近定位孔附近尽量不要布很高的器件。 Positioning hole 3.0mm from the edge of the device can not be cloth, 3.0mm outside

near the positioning holes Try not to cloth near the high device.

定位孔可以利用螺丝孔，但螺丝孔的要求与定位孔一样。

Location holes can make use of screw holes, but the screw holes and positioning

holes as required.

1.1.5 1.1.5 测试点要求 测试点要求

Test-point demand

测试点PAD直径要求大于等于1.5mm；测试点边缘到板边距离要求>2.0mm；测试点边缘

到定位孔边缘距离要求>3.0mm；探针测试点边缘到周围器件距离视器件高度而定，器件越高，间距要求越大，最小1.8mm。

PAD test points required greater than or equal diameter 1.5mm; test point edge

to plate edge distance requirement> 2.0mm; test point hole edge distance from the edge to the positioning requirements> 3.0mm; probe test points around the edge to the height of the device from the device may be, depending on the device is higher the greater the distance required for a minimum 1.8mm. 测试点与焊接面上的元件的间距应大于2.54mm。

Test points and welding surface of the element spacing should be larger than

2.54mm.

测试点离器件尽量远，两个测试点的间距不能太近，中心间距应有2.54mm；否则制作

测试架时很难下针。

Test points as far away from the device, the distance between the two test points

can not be too close to the center distance should be 2.54mm; Otherwise, when the production of test stand is very difficult to pin

低压测试点和高压测试点的间距离应符合安规要求。

Low-voltage test points and the distance between the high-voltage test points

should meet the safety compliance requirements.

尽量不要在BGA背面放测试点，对BGA产生应力会造成焊点断裂或损坏BGA。

Try not to place test points on the back of the BGA, the BGA solder joints cause

stress can cause breakage or damage to the BGA.

测试点和RF测试头不要集中在PCB的某一端，会造成PCB在使用夹具时翘板。

Test points and RF test head Do not focus on one end of PCB, will result in PCB

when using the fixture Rocker.

1.1.6 1.1.6 PCB 丝印要求PCB 丝印要求 丝印要求

PCB Screen Printing requirements

PCB上必须标明PCB板号、机种名称、版本号、Date code等，标识位置必须明确、醒

目；如果不能在PCB正板上表明PCB版本号或者P/N的应该将这些印在5mm的工艺边上。 PCB board PCB must be marked with numbers, aircraft types of name, version number,

Date code, etc., logo position must be clear, eye-catching; if they can not show that PCB board PCB version number is, or P / N's they should be printed on 5mm process edge.

每个元件尽量用丝印框起来，比如电阻，电容等元件，而且不同的元件用不同的方框表

示：比如电阻采用实线方框，电容采用虚线方框或者不间断的线方框，这样便于读取Gerber文件时快速正确的选取相应的元件。如下图：

Each component as far as possible together with the silk screen frame, such as

resistors, capacitors and other components, and different components in different boxes, said: for example, resistance box with solid lines, capacitors, or uninterrupted use of dotted line box box, so that Gerber files easy to read quickly when the correct selection of the corresponding components. The

following figure:

孔造成的丝印残缺不清。

Screen printing can not pad, the screen printing logo should not be overlap between the cross

should not be mounted after

the component block to avoid excessive

Screen hole caused by incomplete unclear.

有极性的元器件及接插件其极性在丝印图上表示清楚，极性方向标识符号要统一，易于

辨认，元件贴装后不得盖住极性标识。特别是数字标识要容易辨识。

Polarity of the components and connectors of its polarity in the screen printing

maps that clearly identifies polarity symbols should be uniform, easy to identify, after the component placement shall not cover the polar identity. In particular digital identity to be easily identified.

对于PCB空间有限不能在元件旁加丝印的可以用方框集中添加或者用箭头标识的方式

指定元件区域，如上图的Q5。

Limited space for the PCB component can not be printed next to Jia Si can focus

on the box to add or use the arrows specify components identified areas, as indicated in diagram Q5.

1.1.7 1.1.7 元件间隔 元件间隔

Element spacing

SMD同种元件间隔应满足≥0.3mm，异种元件间隔≥0.13*h+0.3mm（注：h指两种不同零

件的高度差），THT元件间隔应利于操作和替换。

SMD spacing should meet the same kinds of components, ≥ 0.3mm, heterogeneous

component interval ≥ 0.13 * h +0.3 mm (Note: h means the height difference between two different parts), THT components interval should be conducive to the operation and replacement.

贴装元件焊盘的外侧与相邻插装元件的外侧距离大于2mm。

Mount components of the outer pad and the adjacent cartridge components is

greater than the lateral distance of 2mm.

经常插拔器件或板边连接器周围3mm 范围内尽量不布置SMD（尤其是ＢＧＡ），以防止

连接器插拔时产生的应力损坏器件。

Regular Plug the device or board edge connectors are not as far as possible within

the scope around the 3mm layout SMD (in particular, BGA), in order to prevent the connector plug the stress generated when the device is damaged.

定位孔中心到表贴器件边缘的距离不小于5.0mm。

Positioning hole center to the surface-mount the device away from the edge of not less than 5.0mm.

1.1.8 1.1.8 元件焊盘设计 元件焊盘设计

Component Pad Design

尽量考虑焊盘的方向与流程的方向垂直(只限波峰焊工艺的PCB)。

Also consider the pad direction and perpendicular to the direction of flow (only

wave soldering process PCB).

焊盘的宽度最好等于或稍大于元件的宽度。

The best pad width is equal to or slightly larger than the width of the component. 增加零件焊盘之间的间隙有利于组装；推荐使用小的焊盘。

To increase the gap between the pad part is conducive to assembly; recommend

using a small pad.

SMT元件的焊盘上或其附近不能有通孔，否則在回流焊过程中，焊盘上的焊锡熔化后会

沿着通孔流走，会产生虚焊﹐少錫﹐还可能流到板的另一面造成短路。

SMT component pads on or near the hole can not have otherwise, in the reflow

process, solder on the pad after melt flow away along the through-hole, will produce cold solder joint, a small tin, may also flow to board short-circuit caused by the other side.

不建议在BGA焊盘上打孔，会影响到焊接效果与焊接强度。

Is not recommended in the BGA pads on the hole, it will affect the strength of

welding and welding results.

焊盘两端走线均匀或热容量相当,如下图。

Pads at both ends of the alignment of homogeneous or heat capacity equivalent

to the following diagram

焊盘尺寸大小必须对称。

Pad size must be symmetrical.

大面积铜箔使用隔热带与焊盘相连，即焊盘与铜箔以“米”字或“十”字相连，如下图

所示。

Large-scale use of insulated copper belt and pad connected to the pad and the

copper foil with "m" word or "10" character is connected as shown below.

焊盘两端走线均匀或热容量相当

Pads at both ends of the alignment, or heat capacity fairly evenly

焊盘与铜箔间以 “米”字或 “十”字形连接

Between the pad and the copper foil with "*" word or "+"-shaped connection

1、 无源元件焊盘设计----无源元件焊盘设计----电阻电容,电感 电感 ----电阻,电阻,电容,

Passive Components pad design ----Passive Components pad design ---- resistors, capacitors, inductors---- resistors, capacitors, inductors resistors, capacitors, inductors

根据元件的封装形式，在设计SMT焊盘时可以参考下表的参数值：

According to the package components, in the design of SMT pad can refer to the parameter values in the following table:

Part Z(mm) G(mm) X(mmY(ref)

)

Chip 0201 0.76 0.24 0.30 0.26

Resistors and 0402 1.45~1.5 0.35~0.4 0.55

0.55

Capacitors Capacitors C0603 2.32 0.72 0.8 1.8

R0603 2.4 0.6 1.0 0.9

L0603 2.32 0.72 0.8 0.8

C0805

R0805

L0805

1206

1210

1812

1825

2010

2512

3216(Type A)

3528(Type B)

6032(Type C)

7343(Type D)

2012(0805)

3216(1206)

3516(1406)

5923(2309)

2012Chip(0805)

3216 Chip(1206)

4516 Chip(1806)

2825Prec(1110)

3225Prec(1210) 2.85 3.1 3.25 4.4 4.4 5.8 5.8 6.2 7.4 4.8 5.0 7.6 9.0 3.2 4.4 4.8 7.2 3.0 4.2 5.8 3.8 4.6 0.75 0.9 0.75 1.2 1.2 2.0 2.0 2.6 3.8 0.8 1.0 2.4 3.8 0.6 1.2 2.0 4.2 1.0 1.8 2.6 1.0 1.0 1.4 1.6 1.5 1.8 2.7 3.4 6.8 2.7 3.2 1.2 2.2 2.2 2.4 1.6 2.0 1.8 2.6 1.0 1.6 1.0 2.4 2.0 1.05 1.1 1.25 1.6 1.6 1.9 1.9 1.8 1.8 2.0 2.0 2.6 2.6 1.3 1.6 1.4 1.5 1.0 1.2 1.6 1.4 1.8 Tantalum Capacitors Capacitors Inductors Inductors

2、 无SPEC元件的焊盘设计一般规则 元件的焊盘设计一般规则

No SPEC component pad design a general rule No SPEC component pad design a general rule

焊盘大小要根据元器件的尺寸确定，焊盘的宽度=引脚宽度+2*引脚高度，焊接效果最好；焊盘的长度见图示L2，（L2=L+b1+b2；b1=b2=0.3mm+h;h=元件脚高）。

Pad size should be determined according to the size of components, pin pad width = width + 2 * pin height, the best welding effect; pad the length of the see icons L2, (L2 = L + b1 + b2; b1 = b2 = 0.3mm + h; h = element feet high).

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3、 插件元件孔焊盘设计一般规则 插件元件孔焊盘设计一般规则

PlugPlug-in component design a general rule-hole pad -in component design a general rule-hole pad

对于通孔来说，为了保证焊接效果最佳，引脚与孔径的缝隙应在0.25mm～0.70mm之间。较大的孔径对插装有利，而想要得到好的毛细效果则要求有较小的孔径，因此需要在这两者之间取得一个平衡，终端的手插件少建议用0.25mm～0.40mm孔径的缝隙。

For the through-hole for welding in order to ensure the best results, pin and aperture gap should be between 0.25mm ~ 0.70mm. The larger aperture of the cartridge is beneficial and want to get good capillary effect requires a smaller aperture, would therefore need to strike a balance between the two, a small plug-in terminal is recommended hand-0.25mm ~ 0.40mm aperture slit

一些基本的走线原则 4、 一些基本的走线原则

Some of the basic principles of the alignment of Some of the basic principles of the alignment of

考虑到散热，避免连锡等因素，尽量采用如下图所示的Good Layout，避免Bad Layout。 Taking into account the heat, to avoid even the tin, and other factors, as far as

possible as shown in Good Layout, to avoid Bad Layout.

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两焊点间距很少(如贴片器件相邻的焊盘)时,焊点间不得直接相连.

Two little spot pitch (such as patch device adjacent pad), the solder joints are not permitted to directly connected.

从贴片焊盘引出的过孔尽量离焊盘远些.

Derived from the SMD pad off pad farther away from the hole as far as possible

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