TPS63030中文资料(16)
时间：2025-05-05
元器件交易网SLVS696–
LAYOUTCONSIDERATIONS
Asforallswitchingpowersupplies,thelayoutisanimportantstepinthedesign,especiallyathighpeakcurrentsandhighswitchingfrequencies.Ifthelayoutisnotcarefullydone,theregulatorcouldshowstabilityproblemsaswellasEMIproblems.Therefore,usewideandshorttracesforthemaincurrentpathandforthepowergroundtracks.Theinputcapacitor,outputcapacitor,eacommongroundnodeforpowergroundandadifferentoneforcontrolgroundtominimizetheeffectsofgroundnoise.ConnectthesegroundnodesatanyplaceclosetooneofthegroundpinsoftheIC.
ThefeedbackdividershouldbeplacedascloseaspossibletothecontrolgroundpinoftheIC.Tolayoutthecontrolground,itisrecommendedtouseshorttracesaswell,separatedfromthepowergroundtraces.Thisavoidsgroundshiftproblems,whichcanoccurduetosuperimpositionofpowergroundcurrentandcontrolgroundcurrent.
THERMALINFORMATION
Implementationofintegratedcircuitsinlow-profileandfine-pitchsurface-mountpackagestypicallyrequiresspecialattentiontopowerdissipation.Manysystem-dependentissuessuchasthermalcoupling,airflow,addedheatsinksandconvectionsurfaces,andthepresenceofotherheat-generatingcomponentsaffectthepower-dissipationlimitsofagivencomponent.
Threebasicapproachesforenhancingthermalperformancearelistedbelow. ImprovingthepowerdissipationcapabilityofthePCBdesign
ImprovingthethermalcouplingofthecomponenttothePCBbysolderingthePowerPAD Introducingairflowinthesystem
FormoredetailsonhowtousethethermalparametersinthedissipationratingstablepleasechecktheThermalCharacteristicsApplicationNote(SZZA017)andtheICPackageThermalMetricsApplicationNote(SPRA953)
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