NSS30101LT1G;中文规格书,Datasheet资料
时间:2025-07-11
时间:2025-07-11
NSS30101LT1G30 V, 2 A, Low VCE(sat)NPN Transistor
ON Semiconductor’s e2PowerEdge family of low VCE(sat)transistors are miniature surface mount devices featuring ultra lowsaturation voltage (VCE(sat)) and high current gain capability. Theseare designed for use in low voltage, high speed switching applicationswhere affordable efficient energy control is important.
Typical application are DC DC converters and power managementin portable and battery powered products such as cellular and cordlessphones, PDAs, computers, printers, digital cameras and MP3 players.Other applications are low voltage motor controls in mass storageproducts such as disc drives and tape drives. In the automotiveindustry they can be used in air bag deployment and in the instrumentcluster. The high current gain allows e2PowerEdge devices to bedriven directly from PMU’s control outputs, and the Linear Gain(Beta) makes them ideal components in analog amplifiers.
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30 VOLTS2.0 AMPS
NPN LOW VCE(sat) TRANSISTOREQUIVALENT RDS(on) 100 mW
COLLECTOR
1EMITTER
These Devices are Pb Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TA = 25°C)
Rating
Collector-Emitter VoltageCollector-Base VoltageEmitter-Base VoltageCollector Current ContinuousCollector Current Peak
SymbolVCEOVCBOVEBOICICM
Max30505.01.02.0
UnitVdcVdcVdcAA
SOT 23 (TO 236)
CASE 318STYLE 6
THERMAL CHARACTERISTICS
Characteristic
Total Device DissipationTA = 25°C
Derate above 25°CThermal Resistance,Junction to AmbientTotal Device DissipationTA = 25°C
Derate above 25°CThermal Resistance,Junction to AmbientTotal Device Dissipation(Single Pulse < 10 sec.)Junction and StorageTemperature Range
SymbolPD (Note 1)
Max3102.5
RθJA (Note 1)
PD (Note 2)
4037105.7
RθJA (Note 2)PDsingle
TJ, Tstg
176575
55 to+150
UnitmWmW/°C°C/WmWmW/°C°C/WmW
MARKING DIAGRAM
VS6MG
1
VS6= Specific Device CodeM= Date Code*G= Pb Free Package
(Note: Microdot may be in either location)*Date Code orientation and/or overbar mayvary depending upon manufacturing location.
ORDERING INFORMATION
°C
DeviceNSS30101LT1G
PackageSOT 23(Pb Free)
Shipping 3000/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. MaximumRatings are stress ratings only. Functional operation above the RecommendedOperating Conditions is not implied. Extended exposure to stresses above theRecommended Operating Conditions may affect device reliability.1.FR 4 @ Minimum Pad.
2.FR 4 @ 1.0 X 1.0 inch Pad.
For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationBrochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
August, 2009 Rev. 1
1
Publication Order Number:
NSS30101L/D
NSS30101LT1G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage(IC = 10 mAdc, IB = 0)Collector Base Breakdown Voltage(IC = 0.1 mAdc, IE = 0)Emitter Base Breakdown Voltage(IE = 0.1 mAdc, IC = 0)Collector Cutoff Current(VCB = 30 Vdc, IE = 0)Collector Emitter Cutoff Current(VCES = 30 Vdc)Emitter Cutoff Current(VEB = 4.0 Vdc)
V(BR)CEOV(BR)CBOV(BR)EBOICBOICESIEBO
Vdc
30505.0
Vdc
Vdc
0.10.10.1
mAdcmAdcmAdc
ON CHARACTERISTICS
DC Current Gain (Note 3)(IC = 50 mA, VCE = 5.0 V)(IC = 0.5 A, VCE = 5.0 V)(IC = 1.0 A, VCE = 5.0 V)
Collector Emitter Saturation Voltage (Note 3)(IC = 1.0 A, IB = 100 mA)(IC = 0.5 A, IB = 50 mA)(IC = 0.1 A, IB = 1.0 mA)Base Emitter Saturation Voltage (Note 3)(IC = 1.0 A, IB = 0.1 A)Base Emitter Turn on Voltage (Note 3)(IC = 1.0 mA, VCE = 2.0 V)Cutoff Frequency
(IC = 100 mA, VCE = 5.0 V, f = 100 MHzOutput Capacitance (f = 1.0 MHz)
3.Pulsed Condition: Pulse Width = 300 msec, Duty Cycle ≤ 2%
hFE
300300200 100
900
V
0.2000.1250.075
V
1.1
V
1.1
MHz
pF
15
VCE(sat)
VBE(sat)VBE(on)fTCobo
1.00.90.80.7VCE (V)
0.60.50.40.30.20.10
Ib (A)
VCE (V)
1.00.90.80.70.60.50.40.30.20.10Ic (A)
Figure 1. VCE versus I
bFigure 2. VCE versus Ic
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2
NSS30101LT1G
800700600
VBE(on) (V)
500hFE
4003002001000Ic (A)
0.20Ic (A)
0.80.60.4
1.0
1.2
Figure 3. hFE versus IcFigure 4. VBE(on) versus Ic
1.21.00.8VBE (V)
0.60.40.20Ic (A)
IC COLLECTOR CURRENT (A)
10
1
VCE (V)
0.1
0.01
Figure 5. VBE(sat) versus Ic
1.0E+00
1.0E-01Rthja, (t)
Figure 6. Safe Operating Area
1.0E-02
1.0E-03
1E-05
0.0001
0.001
0.01
0.1t, TIME (sec)
1.0
10
100
1000
Figure 7. Normalized Thermal Response
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3
NSS30101LT1G
PACKAGE DIMENSIONS
SOT 23 (TO 236)CASE 318 08ISSUE AN
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.
2.CONTROLLING DIMENSION: INCH.
3.MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OFBASE MATERIAL.
4.318 01 THRU 07 AND 09 OBSOLETE, NEWSTANDARD 318 08.
VIEW C
DIMbLE0.370.100.440.500.200.300.0150.004INCHES0.0180.0080.0200.012STYLE 6:
PIN 1.BASE
2.EMITTER3.COLLECTOR
SOLDERING FOOTPRINT*
SCALE 10:1
*For additional information on our Pb Free strategy and soldering
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