STM32 WLCSP封装设计参考

TN1163

Technical note

Description of WLCSP for microcontrollers and recommendations

for use

Introduction

This document describes the WLCSP (wafer level chip size package), and provides

recommendation on how to use it. Only WLCSP for microcontrollers are described herein.The competitive market of portable equipment, in particular the mobile phone market, is driven by the challenging development of highly integrated devices. To allow manufacturers of portable equipment to minimize the dimension of their devices, STMicroelectronics has developed WLCSP with reduced size, thickness and weight. The electrical performance of such components is improved by using shorter connections than in standard plastic packages such as TSSOP, SSOP or BGA.

The WLCSP family has been designed to fulfill the same quality levels and same reliability performance as standard semiconductor plastic packages. As a consequence these new WLCSP can be considered as new surface mount devices which are assembled on a printed circuit board (PCB) without any special or additional process steps. In particular these packages do not require any extra underfill to increase reliability performance or to protect the device. These packages are compatible with existing pick-and-place equipment for board mounting. Only Lead-free RoHS compliant WLCSP are available in mass production. The packages offered in WLCSP are listed in Table 1.This document addresses the following topics: Package description Device marking

Packing specifications and labeling Storage and shipping recommendations Soldering assembly recommendations Package changes and package quality

Table 1. WLCSPs for microcontrollers

Package

Description

WLCSP28 package WLCSP49 package WLCSP63 package WLCSP66 package WLCSP64 packageWLCSP90 packageWLCSP143 package

Pitch (μm)

400400400400500400400400

Ball diameter (μm)

270250270270320270270250

WLCSP28WLCSP49WLCSP63WLCSP66WLCSP64WLCSP64WLCSP90WLCSP143

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STM32 WLCSP封装设计参考

ContentsTN1163

Contents

1

Package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.11.21.3

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Mechanical description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Device marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2Packing specifications and labelling description . . . . . . . . . . . . . . . . . 8

2.12.22.32.42.52.6

Carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Cover tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Reels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Final packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11Labelling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11Storage and shipping recommendations . . . . . . . . . . . . . . . . . . . . . . . . . .11

3Soldering assembly recommendations . . . . . . . . . . . . . . . . . . . . . . . . 12

3.13.2

PCB design recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12PCB assembly guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.2.13.2.2

Protection against light exposure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Underfilling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4Manual rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.14.2

Rework procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Component rework equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

56

Package changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Package quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.16.2

Electrical inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Visual inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

78

Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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STM32 WLCSP封装设计参考

TN1163List of tables

List of tables

Table 1.Table 2.Table 3.Table 4.Table 5.Table 6.Table 7.

WLCSPs for microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Matrix 8 x 8 bump dimension WLCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Tape cavity size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 and 13 inch reel dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10PCB design recommendation for 0.5 mm ball pitch packages. . . . . . . . . . . . . . . . . . . . . . 12PCB design recommendation for 0.4 mm ball pitch packages. . . . . . . . . . . . . . . . . . . . . . 12Document revision history . . . . . . . . . . . . . . . . …… 此处隐藏：20865字，全部文档内容请下载后查看。喜欢就下载吧 ……