BAP50-03,115;BAP50-03,135;中文规格书,Datasheet资料

BAP50-03

General purpose PIN diode

Rev. 04 — 11 September 2009

Product data sheet

1.Product pro le

1.1General description

General purpose PIN diode in a SOD323 small plastic SMD package.

1.2Features

ILow diode capacitance

ILow diode forward resistance

1.3Applications

IGeneral RF application

2.Pinning information

Table 1.2

Discrete pinning

anode

sym006

3.Ordering information

Table 2.

Ordering information

General purpose PIN diode

4.Limiting values

Table 3.Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

VRIFPtotTstgTj

reverse voltageforward currenttotal power dissipationstorage temperaturejunction temperature

Tsp=90°C

--- 65 65

5050500+150+150

VmAmW°C°C

5.Thermal characteristics

Table 4.Rth(j-sp)

Thermal characteristicsthermal resistance from junctionto soldering point

85

K/W

6.Characteristics

Table 5.Characteristics

T

= 25°C unless otherwise speci ed.VFVRIRCd

forward voltagereverse voltagereverse currentdiode capacitance

IF=50mAIR=10µAVR=50V

RVR=1VVR=5V

rD

diode forward resistance

FIF=1mAIF=10mA

[1]

Guaranteed on AQL basis: inspection level S4, AQL 1.0.

[1][1]

-50-----

0.95--0.30.2143

1.1-1000.550.35255

VVnApFpF

General purpose PIN diode

General purpose PIN diode

7.Package outline

Fig 5.

Package outline SOD323

General purpose PIN diode

8.Abbreviations

Table 6.AQLPINSMDRFS4

Abbreviations

Acceptable Quality LevelP-type, Intrinsic, N-typeSurface Mounted DeviceRadio FrequencySpecial inspection level 4

9.Revision history

Table 7.

Revision history

20090911

Product data sheet

-BAP50-03_3

BAP50-03_4Modi cations:

The format of this data sheet has been redesigned to comply with the new identityguidelines of NXP Semiconductors.

Legal texts have been adapted to the new company name where appropriate.

Product data sheetProduct data sheetPreliminary data sheet

BAP50-03_2BAP50-03_N_1-

BAP50-03_3BAP50-03_2BAP50-03_N_1

200402111999051019990201

General purpose PIN diode

10.Legal information

10.1Data sheet status

Objective [short] data sheetPreliminary [short] data sheetProduct [short] data sheet

[1][2][3]

DevelopmentQuali cationProduction

This document contains data from the objective speci cation for product development.This document contains data from the preliminary speci cation.This document contains the product speci cation.

Please consult the most recently issued document before initiating or completing a design.The term ‘short data sheet’ is explained in section “De nitions”.

Theproductstatusofdevice(s)describedinthisdocumentmayhavechangedsincethisdocumentwaspublishedandmaydifferincaseofmultipledevices.Thelatestproductstatusinformation is available on the Internet at URLhttp://www.77cn.com.cn.

10.2De nitions

Draft —The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodi cations or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness of

informationincludedhereinandshallhavenoliabilityfortheconsequencesofuse of such information.

Short data sheet —A short data sheet is an extract from a full data sheetwiththesameproducttypenumber(s)andtitle.Ashortdatasheetisintendedforquickreferenceonlyandshouldnotbereliedupontocontaindetailedandfull information. For detailed and full information see the relevant full datasheet, which is available on request via the local NXP Semiconductors salesof ce. In case of any inconsistency or con ict with the short data sheet, thefull data sheet shall prevail.

damage. NXP Semiconductors accepts no liability for inclusion and/or use ofNXP Semiconductors products in such equipment or applications andtherefore such inclusion and/or use is at the customer’s own risk.

Applications —Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for thespeci ed use without further testing or modi cation.

Limiting values —Stress above one or more limiting values (as de ned intheAbsoluteMaximumRatingsSystemofIEC60134)maycausepermanentdamagetothedevice.Limitingvaluesarestressratingsonlyandoperationofthe device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limitingvalues for extended periods may affect device reliability.

Terms and conditions of sale —NXP Semiconductors products are soldsubjecttothegeneraltermsandconditionsofcommercialsale,aspublishedathttp://www.77cn.com.cn/pro le/terms, including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unlessexplicitly otherwise agreed to in writing by NXP Semiconductors. In case ofany inconsistency or con ict between information in this document and suchterms and conditions, the latter will prevail.

No offer to sell or license —Nothing in this document may be interpretedor construed as an offer to sell products that is open for acceptance or thegrant,conveyanceorimplicationofanylicenseunderanycopyrights,patentsor other industrial or intellectual property rights.

Export control —This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from national authorities.

10.3Disclaimers

General —Information in th …… 此处隐藏：5338字，全部文档内容请下载后查看。喜欢就下载吧 ……