SL74HCT374

MAXIMUM RATINGS*

Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL

*

Parameter

DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin

DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature

Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package)

Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5

±20 ±35 ±75 750 500 -65 to +150

260

Unit V V V mA mA mA mW °C °C

Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C

SOIC Package: : - 7 mW/°C from 65° to 125°C

RECOMMENDED OPERATING CONDITIONS

Symbol VCC VIN, VOUT TA tr, tf

This device contains protection circuitry to guard against damage due to high static voltages or electric

fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC.

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).

Unused outputs must be left open.

Parameter

DC Supply Voltage (Referenced to GND)

DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1)

Min 4.5 0 -55 0

Max 5.5 VCC +125 500

Unit V V °C ns