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HIGH VOLTAGE CHIP CAPACITORS1. PART NO. EXPRESSION:

V7N SERIES

V7N680J-J-10(a) (b) (c) (d) (e) (f)

(a) Chip Size (b) Temp. Coefficient: N ( 30ppm/°C ) ( Temp. range: -55°C to+125°C ) (c) Capacitance code: 680= 68pF

(d) Tolerance code (e) Voltage code: J= 1000Vdc (f) 10: Lead Free

2. CONFIGURATION& DIMENSIONS:A D L G

B

C

PCB Pattern Unit:m/m

A

B

C

D

G

H

L

4.60±0.30 3.20±0.30 3.00 Max.

0.30 Min. 2.80 - 3.40 2.30 - 3.00 1.80 - 2.00

3. SCHEMATIC:

4. MATERIALS: b aAg(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.)

(a) Body: Ceramic (b) Termination: Ag/Ni/Sn

5. GENERAL SPECIFICATION: a) Storage temp.:+5°C to+40°C b) Operating temp.: -55°C to+125°C c) Resistance to solder heat: 260°C.10secs

NOTE: Specifications subject to change without notice. Please check our website for latest information.

H

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HIGH VOLTAGE CHIP CAPACITORS6. ELECTRICAL CHARACTERISTICS: ( Rated Voltage: 1KVdc ) Part Number V7N680 -J-10 V7N820 -J-10 V7N101 -J-10 V7N121 -J-10 V7N151 -J-10 V7N181 -J-10 V7N221 -J-10 V7N271 -J-10 V7N331 -J-10 V7N391 -J-10 V7N471 -J-10 V7N561 -J-10 V7N681 -J-10 V7N821 -J-10 V7N102 -J-10 V7N122 -J-10 V7N152 -J-10 V7N182 -J-10 V7N222 -J-10 Tolerance code:: C:±0.25pF D:±0.50pF J:±5% K:±10% M:±20% Capacitance ( pF ) 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 Part Number V7N272 -J-10 V7N332 -J-10 V7N392 -J-10 V7N472 -J-10 V7N562 -J-10 V7N682 -J-10

V7N SERIES

Capacitance ( pF ) 2700 3300 3900 4700 5600 6800

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HIGH VOLTAGE CHIP CAPACITORS6. ELECTRICAL CHARACTERISTICS: ( Rated Voltage: 2KVdc ) Part Number Capacitance ( pF ) 68 82 100 120 150 180 220 270 330 390 470

V7N SERIES

V7N680 -L-10 V7N820 -L-10 V7N101 -L-10 V7N121 -L-10 V7N151 -L-10 V7N181 -L-10 V7N221 -L-10 V7N271 -L-10 V7N331 -L-10 V7N391 -L-10 V7N471 -L-10 Tolerance code:: C:±0.25pF D:±0.50pF J:±5% K:±10% M:±20%

NOTE: Specifications subject to change without notice. Please check our website for latest information.

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HIGH VOLTAGE CHIP CAPACITORS6. ELECTRICAL CHARACTERISTICS: ( Rated Voltage: 3KVdc ) Part Number Capacitance ( pF ) 68 82 100 120 150 180 220 270 330 330 390 470 270 330 330 390 470 390 470 Part Number

V7N SERIES

Capacitance ( pF ) 2200 2700 3300 3900 4700 5600

V7N100 -N-10 V7N120 -N-10 V7N150 -N-10 V7N180 -N-10 V7N220 -N-10 V7N270 -N-10 V7N330 -N-10 V7N390 -N-10 V7N470 -N-10 V7N560 -N-10 V7N680 -N-10 V7N820 -N-10 V7N101 -N-10 V7N121 -N-10 V7N151 -N-10 V7N181 -N-10 V7N221 -N-10 V7N271 -N-10 V7N331 -N-10 Tolerance code:: C:±0.25pF D:±0.50pF J:

±5% K:±10% M:±20%

V7N391 -N-10 V7N471 -N-10 V7N561 -N-10 V7N681 -N-10 V7N821 -N-10 V7N102 -N-10

NOTE: Specifications subject to change without notice. Please check our website for latest information.

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HIGH VOLTAGE CHIP CAPACITORS7. RELIABILITY& TEST CONDITION:

V7N SERIES

ITEMElectrical Characteristics Test Visual Insulation Resistance

PERFORMANCE

TEST CONDITION

No abnormal exterior appearance 10,000M or 500/C product whichever is smaller

Visual inspection V< 500V, Rated Voltage V> 500V, Applied 500Vdc Charge Time: 60sec is applied less than 50mA current

Capacitance

Within the specified tolerance[Class I (N)& Class II]

Class I: C< 100pF: Freq.= 1MHz±10%, Voltage= 1.0±0.2Vrms C> 100pF: Freq.= 1KHz±10% Class II: X: Freq.= 1KHz±10%, Voltage= 1.0±0.2Vrms Z/E: Freq.= 1KHz±10%, Voltage= 1.0±0.2Vrms Perform a heat temp. at 150±5°C for 30min. then place room temp. for 24±2hr

Q

Class I (N): More than 30pF: Q> 1000 30pF& below: Q> 400+20C (C: Capacitance, pF)

Tan Withstanding Voltage

Class II (X): 2.5% maximum Class II (Z/E): 4.0% maximum No dielectric breakdown or mechanical breakdown 200V< V< 500V: 200% rated voltage 500V< V< 1000V: 150% rated voltage 1000< V: 120% rated voltage for 1-5sec. Current is limited to less than 50mA.* Withstanding voltage testing requires immersion of the element in a isolation fluid prevent arching on the chip surface, at voltage over 1000Vdc.

Temperature Capacitance Coefficient

Class I: Char. N Class II: Char. X E Z Temp. Range -55°C~+125°C -30°C~+85°C+10°C~+85°C Cap. Change (%)±15%+22%~ -56%+22%~ -56% Temp. Range -55°C~+125°C Cap. Change (%)±30ppm/°C

Class I:[C2-C1/C1(T2-T1)] x 100% Class II: (C2-C1)/C1 x 100% T1: Standard temperature (25°C) T2: Test temperature C1: Capacitance at standard temperature (25°C) C2: Capacitance at test temperature (T2)

Adhesive Strength of Termination

No indication of peeling shall occur on the terminal electrode

A 5N f pull force shall be applied for 10±1second

5N f

Resistance to Flexure of Substrate

Appearance: No mechanical damage shall be occur C-Meter: Capacitance Change

Bending shall be applied to the 1.0mm with 1.0mm/sec R230

C Meter

45±1mm

45±1mm

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Bending Limit

N:<±5.0% X:<±12.5% E/Z:<±30.0%

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HIGH VOLTAGE CHIP CAPACITORS7. RELIABILITY& TEST CONDITION:

V7N SERIES

ITEMSolderability

PERFORMANCEMore than 90% of the terminal surface is to be soldered newly, so metal part does not come out or dissolve

TEST CONDITIONSolder Temp.: 245±5°C Dip Time: 5±0.5sec Immersing Speed: 25±10% mm/s Solder: H63A Flux: Rosin Preheat: At 80~120°C for 10~30sec Class II ca

pacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Preheat: At 150±10°C for 60~120sec Dip: Solder Temp. of 260±5°C Dip Time: 10±1sec Immersing speed: 25±10% mm/s Solder: H63A Flux: Rosin Measure at room temp. after cooling for Class I: 24±2 hrs Class II: 48±4 hrs

Resistance to Soldering Heat

Appearance: No mechanical damage shall be occur Class I: Char. N Capacitance change Within±2.5% or±0.25pF whichever is larger of initial value

Class II: Char. X Z/E Capacitance change Within±10% Within±20%

Q(Class I), Tan (Class II), Insulation Resistance& Withstand Voltage: To satisfy the specified initial value Temperature Cycle Appearance: No mechanical damage shall be occur Class I: Char. N Capacitance change Within±2.5% or±0.25pF whichever is larger of initial value Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Step 1 2 3 4 Capacitance change Within±7.5% Within±20% Temp. (°C) Min. rated temp.+0/-3 25 Min. rated temp.+3/-0 25 Time (min) 30 3 30 3

Class II: Char. X/B Y/Z/E

Measure at room temp. after cooling for Class I: 24±2 hrs Class II: 48±4 hrs Solder the capacitor on P.C. board before testing

Q(Class I), Tan (Class II)& Insulation Resistance: To satisfy the specified initial value Humidity Appearance: No mechanical damage shall be occur Class I: Char. N Capacitance change Within±5.0% or±0.5pF whichever is larger of initial value

Class II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Temperature: 40±2°C Relative Humidity: 90~95% RH Test Time: 500+12/-0 hr Measure at room temp. after cooling for Class I: 24±2 hrs Class II: 48±4 hrs Solder the capacitor on P.C. board before testing

Class II: Char. X Z/E Capacitance change Within±15% Within±30%

NOTE: Specifications subject to change without notice. Please check our website for latest information.

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HIGH VOLTAGE CHIP CAPACITORS7. RELIABILITY& TEST CONDITION:

V7N SERIES

ITEMHumidity

PERFORMANCEQ(Class I): More than 30pF: Q> 350 30pF& below: Q> 275+2.5xC Tan X Z/E (Class II): Maximum 5.0% 5.0%

TEST CONDITIONClass II capacitor shall be set for 48±4 hrs at room temp. after 1 hr heat treatment at 150+0/-10°C before initial measure. Temperature: 40±2°C Relative Humidity: 90~95% RH Test Time: 500+12/-0 hr Measure at room temp. after cooling for Class I: 24±2 hrs Class II: 48±4 hrs Solder the capacitor on P.C. board before testing Class II capacitors applied DC voltage (following table) is applied for 1 hr at max. operation temp.±3°C then shall be set for 48±4 hrs at room temp. and the initial measurement shall be conducted. Applied Voltage: Rated Voltage V< 250Vdc Less than 1KVdc More than 1KVdc (inc

lude 1KV) Applied Voltage 150% rated voltage 120% rated voltage 100% rated voltage

Char.

Insulation Resistance: 1,000M or 50/C whichever is smaller.

High Temperature Load

Appearance: No mechanical damage shall be occur Class I: Char. N Capacitance change Within±3.0% or±0.3pF whichever is larger of initial value

Class II: Char. X Z/E Capacitance change Within±15% Within±30%

Q(Class I): More than 30pF: Q> 350 30pF& below: Q> 275+2.5xC Tan X Z/E (Class II): Maximum 5.0% 5.0%

Temp.: Max. operation temperature Test Time: 1000+12/-0 hr Current Applied: 50mA max. Measure at room temp. after cooling for Class I: 24±2 hrs Class II: 48±4 hrs

Char.

Insulation Resistance: 1,000M or 50/C whichever is smaller. (C in Farad) Vibration Appearance: No mechanical damage shall be occur Class I: Char. N Capacitance change Within±2.5% or±0.25pF whichever is larger of initial value Solder the capacitor on P.C. board before testing Vibrate the capacitor with amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55 Hz and back to 10Hz in about 1min. Repeat this for 2 hrs each in 3 perpendicular directions

Class II: Char. X Z/E Capacitance change Within±7.5% Within±20%

Q(Class I), Tan (Class II)& Insulation Resistance: To satisfy the specified initial value

NOTE: Specifications subject to change without notice. Please check our website for latest information.

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HIGH VOLTAGE CHIP CAPACITORS8. SOLDERIND AND MOUNTING: 8-1 Re-flow Soldering:

V7N SERIES

Preheat and gradual increase in temp. to the reflow temp. is recommended to decrease the potential of the thermal crack on the components. The recommended heating rate depends on the size of the component, however it should not exceed 3°C/sec. 8-2 Wave Soldering: Most of the components are wave soldered with solder at 230~250°C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to Figure 2 for optimum soldering benefits.

8-3 Hand Soldering: Sudden temp. change in components, results in a temp. gradient, and therefore may cause internal thermal cracks in the components. In general a hand soldering method is not recommend unless proper preheating and handling practices have been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder iron. How to solder repair by solder iron: 1) Selection of soldering iron tip The required temp. of solder iron for any type of repair depends on the type of the tip, the substrate material, and the solder land size 2) recommended solder iron condition a) Preheat substrate to (60°C~120°C). b) 350°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt (max.) soldering iron with tip diameter of 3.0mm f) Limit soldering time to 5 secs. Cooling condition: Natural cooling using air is

recommended. If the chips are dipped into a solvent for cleaning, the temp. difference between the solvent and the chips must be less than 100°C.

TEMPERATURE°C

TEMPERATURE°C

Preheating260 217

Soldering

Natural cooling

Preheating300 250 230 200

Soldering

Natural cooling

Over 1min.

Over 1min.

Gradual Cooling 70-90secs

Over 2mins.

Over 1min 2-3secs.

Figure 1. Re-flow Soldering

Figure 2. Wave Soldering

TEMPERATURE°C

Preheating350 250 200

Soldering

Natural cooling

Within 5secs.

Figure 3. Hand Soldering

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HIGH VOLTAGE CHIP CAPACITORS9. PACKAGING INFORMATION: 9-1. Reel DimensionTYPEW A

V7N SERIES

A(mm) 382 Max. 382 Max. 382 Max. 382 Max. 178±0.2 178±0.2 178±0.2

B(mm) 50 Min. 50 Min. 50 Min. 50 Min. 60±0.2 60±0.2 60±0.2

C(mm) 13±0.5 13±0.5 13±0.5 13±0.5 13±0.5 13±0.5 13±0.5

D(mm) 21±0.8 21±0.8 21±0.8 21±0.8 21±0.8 21±0.8 21±0.8

E(mm) 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5 2.0±0.5

W(mm) 10±0.15 10±0.15 10±0.15 10±0.15 13±0.3 13±0.3 13±0.3

V2 V3E C

V4 V5 V6D

B

V7 V8

9-2. Tape Dimension

Ø1.5+0.1 -0 1.75±0.1 A

4.0±0.1

2.0±0.05

TYPE8.0±0.3

Ao(mm) 1.1±0.2 1.5±0.2 1.9±0.2 2.9±0.2

Bo(mm) 1.9±0.2 2.3±0.2 3.5±0.2 3.6±0.2

Ko(mm) 1.1 MAX. 1.1 MAX. 1.1 MAX. 1.1 MAX.

P(mm) 4.0±0.1 4.0±0.1 4.0±0.1 4.0±0.1

3.5±0.05

V2Bo

V3 V4

A

P

Ao

Ko

Section A-A

V5

Ø1.5+0.1 -0 1.75±0.1 A

4.0±0.1

2.0±0.05

t

TYPE12.0±0.3 5.5±0.05

Ao(mm) 2.5±0.2 3.6±0.2 5.4±0.2

Bo(mm) 4.9±0.2 4.9±0.2 6.1±0.2

Ko(mm) 4.0 MAX. 4.0 MAX. 4.0 MAX.

P(mm) 4.0±0.1 4.0±0.1 4.0±0.1

t(mm) 0.3 MAX. 0.3 MAX. 0.3 MAX.

V6Bo

V7Ko

A 1.5±0.1

P

Ao

V8

Section A-A

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HIGH VOLTAGE CHIP CAPACITORS

V7N SERIES

9-3. Packaging QuantityV2/ V3 Tape Mat'l Paper Plastic T<0.90mm 4000pcs/reel T>0.90mm 3000pcs/reel T<0.90mm 4000pcs/reel V4 0.90mm<T<1.25mm 3000pcs/reel T>1.25mm 2000pcs/reel

V5/ V6 Tape Mat'l Paper Plastic T<1.25mm 3000pcs/reel T>1.25mm 2000pcs/reel

V7/ V8 T<2.20mm 1000pcs/reel T>2.20mm 700pcs/reel T: Chip Thickness

9-4. Tearing Off Force F165° to 180°

Top cover tape Base tape

The force for tearing off cover tape is 5 to 70 grams in the arrow direction under the following conditions.

StorageStore the capacitors where the temp. and relative humidity do not exceed 40°C and 70%RH. Capacitors are recommended to be used within 6 months from the date of manufacturing. Store the products in the original package and do not open the outer wrapped, polyethylene bag, till just before usage. If is open, seal it as soon as possible or keep it in a desiccant with a desiccat

ion agent.

NOTE: Specifications subject to change without notice. Please check our website for latest information.

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