高SiCp或高Si含量电子封装材料研究进展(5)
发布时间:2021-06-11
发布时间:2021-06-11
一直被模仿,从未被超越!
高SiCp或高Si含量电子封装材料研究进展/钟
鼓等
车领域的电子封装,其性能优越性得到凸现。我国对SiCp/Al复合材料的研制始于20世纪90年代后期,现已初步完成了复杂形状预制件的注射成形和构件近净成形研究,并在产品中得到应用,与国外同体积分数SiCp/Al封装材料相比CTE值基本接近,但热导率还存在较大差距。高Si含量Al2Si合金用于电子封装的制备国内最近几年才有报道,且成形方法还比较单一。目前各种制备方法成本均比较高,产品还难以在大规模商业生产中推广,因此研究和开发适于规模化生产的净成形工艺具有重要意义。
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